High Performance Conductive Thermal Cooling Pad

Optimize your hardware's thermal efficiency with the High Performance Conductive Thermal Cooling Pad. Constructed with a specialized High Thermal Conductivity Silicone Matrix, this pad is developed to provide a definitive balance of heat dissipation and structural gap filling for sensitive electronics. Featuring a high performance 21W/m.K Thermal Link, it serves as the definitive choice for GPU and CPU heatsink applications where a reliable, non-conductive interface is required for long term structural stability.

Perfect For

• GPU VRAM Thermal Mapping: Specifically intended for maintaining optimal temperatures on high speed video memory and VRM components during intense gaming or mining.

• CPU Heatsink Engineering: The professional choice for liquid cooling and air cooling setups, specifically intended to bridge the interface between processors and heat spreaders.

• SSD and Laptop Integration: Developed with specialized low-profile geometries specifically intended to fit the tight tolerances of M.2 drives and internal mobile hardware.

• Industrial Electronics Utility: Providing a high performance structural link for power supplies and LED drivers, specifically intended for continuous heat transfer in high-stress environments.

• Custom Overclocking Security: Utilized as a specialized high-wattage hardware set specifically intended for maintaining professional performance standards under extreme thermal loads.

Why Choose This Product

• Premium 21W/m.K Power Build: Utilizing specialized advanced silicone compounds specifically designed for industry leading heat transfer efficiency.

• Advanced Non Conductive Interface: Featuring specialized electrical insulation properties specifically intended to provide professional grade safety against short circuits on sensitive PCBs.

• Precision Elasticity Geometry: Providing a specialized soft texture specifically intended to ensure maximum surface contact by conforming to irregular component shapes.

• Comprehensive Thickness Specification Frame: Offering a professional grade range from 0.5mm to 3.0mm specifically intended to provide structural versatility for varied gap requirements.

• Enhanced High Temperature Frame: Offering specialized thermal stability specifically intended to provide structural versatility by resisting hardening or leaking over years of use.

Product Specifications