BGA Reballing Kit with Steel Stencils and Mesh Station for SMT Repair

Introduction
Repair ball grid array chips with precision using this BGA Reballing Kit. Featuring a steel mesh station and universal stencils, it simplifies solder ball placement for accurate and efficient rework.

Key Features

• Includes steel mesh station for secure stencil alignment

• Comes with BGA reballing stencils suitable for various chip sizes

• Includes solder paste and tin balls for a complete repair setup

• Durable construction ensures repeated use

Why Choose This Kit
This kit offers precision and convenience in one all-in-one solution. It streamlines the reballing process by ensuring accurate solder ball placement and fast setup, making it a valuable addition for technicians and hobbyists.

Perfect For

• Electronics repair technicians specializing in BGA reballing

• Hobbyists performing DIY chip repairs

• Small businesses needing reliable rework tools

How to Use
Position the stencil over the BGA pads, fill with tin balls or solder paste, use the mesh plate to hold everything in place, then apply controlled heat for precise ball soldering.

Product Specs
• Kit includes steel mesh station stencils solder paste and tin balls
• Material stainless steel and solder alloy components
• Usage BGA reballing and SMT rework

Elevate your repair accuracy with this complete reballing kit